Mission Statement, Vision, & Core Values (2026) of Shenzhen Techwinsemi Technology Co., Ltd.

At the heart of Shenzhen Techwinsemi Technology Co., Ltd. (stock code 001309.SZ) lies a bold pledge-"True Core Changes the World"-driving its push to lead the storage revolution with high-performance storage controller chips, SSDs and flash memory cards from an intelligent manufacturing base spanning nearly 20,000 square meters; serving customers in over 100 countries, TWSC combines globalization, deep R&D and first-tier supply chain leverage to deliver autonomous, secure and reliable storage solutions, underpinned by recognized quality and sustainability credentials including ISO9001, ISO14001, ISO45001, QC080000 and BSCI, while its mission, vision and core values prioritize technological excellence, open collaboration, customer-centricity, integrity and ESG-driven innovation to shape the future of the global semiconductor and data era.

Shenzhen Techwinsemi Technology Co., Ltd. (001309.SZ) - Intro

• Mission: 'True Core Changes the World' - deliver core storage technologies that enable secure, high-performance data platforms for customers, partners, and ecosystems.
• Vision: To be a leading global semiconductor and storage systems innovator, shaping the future of data storage with intelligent, interoperable solutions.
• Core values: customer-centricity, technological excellence, quality & compliance, collaboration, and sustainable manufacturing.

• Integrated intelligent manufacturing base: nearly 20,000 square meters combining R&D, design, validation, and production lines to accelerate time-to-market and maintain tight quality control.
• Global reach: products and services delivered to customers across more than 100 countries and regions, supporting customized solutions for enterprise, cloud, embedded, and consumer segments.
• Product portfolio highlights: high-performance storage controller chips, enterprise and consumer SSDs, flash memory cards, and OEM/ODM storage modules emphasizing agility, stability, security, and compatibility.

• R&D-driven roadmap: sustained investment in controller architecture and firmware to support NVMe, PCIe Gen4/Gen5 interfaces and AI/data-center workloads.
• Manufacturing scale: nearly 20,000 m² intelligent base enabling parallel validation lines, shortened validation cycles, and improved defect containment.
• Global customer support: multi-region technical teams and customization capabilities to serve over 100 countries with localized partner networks.

• Brand tagline: 'True Innovation Changes the World' - emphasizing globalization, technical depth, and professional service orientation.
• Partnering ethos: technology and channel partnerships aimed at mutual growth across cloud providers, system integrators, OEMs, and consumer electronics makers.

Shenzhen Techwinsemi Technology Co., Ltd. (001309.SZ) - Overview

• Mission focus: Drive innovation in storage ICs and system solutions to meet evolving global data needs.
• Globalization: Expand international market presence and partnerships while strengthening domestic supply-chain resilience.
• Customer-centricity: Deliver differentiated performance, reliability, and cost-efficiency tailored to cloud, data center, mobile and embedded customers.
• Open collaboration: Establish cross-industry alliances, licensing, and channel partnerships to accelerate adoption and shared growth.
• Continuous innovation: Maintain R&D intensity to sustain product roadmaps at the technology frontier.

• Integrity - transparent governance and compliance across manufacturing and IP practices.
• Excellence - engineering rigor, reliability testing, and performance verification as non-negotiable standards.
• Collaboration - partner-first mindset with OEMs, hyperscalers, and foundries to co-create solutions.
• Customer Value - product roadmaps driven by measurable customer ROI, uptime, and life-cycle cost reduction.
• Agility - rapid iteration across firmware, firmware-to-hardware co-design, and time-to-market responsiveness.

• Capital allocation: Emphasis on balancing R&D, strategic M&A or partnerships, and operational scale to support global go-to-market efforts.
• Profitability lens: Pursue margin expansion through IP monetization, software/firmware differentiation, and higher-value product tiers.
• Risk management: Diversify supplier base and strengthen quality assurance to mitigate volatility in NAND and wafer supply cycles.

• Foundry relationships - design-for-manufacturability and co-optimization with wafer partners.
• Channel integrators - certification programs and technical enablement for system OEMs and hyperscale customers.
• Standards & consortia - participation to ensure interoperability and to influence storage architecture evolution.

Shenzhen Techwinsemi Technology Co., Ltd. (001309.SZ) - Mission Statement

• Deliver industry-leading storage controller chips and integrated solutions that meet global enterprise, cloud, and edge requirements.
• Leverage top-tier global supply chain resources to accelerate time-to-market and ensure manufacturing resilience.
• Invest continuously in R&D to build domestic technology independence while contributing to global semiconductor competitiveness.
• Foster open partnerships across ecosystems to enable shared innovation, interoperability, and scale.

• Global Influence: Aim to be an integrated circuit company with global influence by expanding product reach across North America, Europe, and APAC customers and partners.
• Technology Excellence: Prioritize development of cutting-edge, high-performance storage controllers (e.g., PCIe Gen 4/5 and NVMe architectures) as the technical foundation for broader storage stack breakthroughs.
• Comprehensive Solutions: Provide end-to-end storage offerings - from controller silicon to firmware, reference platforms, and validation suites - ensuring customers receive autonomous, secure, and reliable storage support.
• Open Collaboration: Promote industry partnerships (IP partners, foundries, memory suppliers, ODMs/OEMs) to accelerate adoption and mutually beneficial growth.
• Competitiveness & Scale: Continuously raise overall competitiveness via yield improvement, cost reductions, and design-for-manufacturing optimizations to contribute meaningfully to global semiconductor progress.

• Supply chain integration: Secure multi-sourced memory and wafer supply from global top-tier vendors to reduce lead-time volatility and negotiate favorable pricing tiers.
• IP & ecosystem partnerships: Co-develop firmware stacks and validation tools with industry leaders to accelerate interoperability and customer qualification cycles.
• R&D focus areas: NVMe optimization, LDPC/Turbo ECC advancements, power-efficiency scaling, and firmware AUTONOMY/secure boot hardening.
• Commercialization pathway: Aggressive qualification cadence with cloud, OEM, and channel partners to convert design wins into volume shipments within 12-24 months of tape-out.

• Number of certified partners and qualified platforms (target: 50+ across OEMs, cloud, storage vendors).
• Time-to-qualification for new controllers (goal: ≤ 12 months with strategic partners).
• Percent of revenue from strategic partnerships vs. one-off customers (goal: increase recurring, contract-based revenue share).
• Patents and IP filings per year (to reflect technological leadership and protection of innovations).

Shenzhen Techwinsemi Technology Co., Ltd. (001309.SZ) - Vision Statement

• Accelerate R&D intensity to 8-10% of annual revenue to maintain leadership in NAND controller, SSD firmware, and system-level storage integration.
• Target a production footprint capable of delivering 200,000+ enterprise and consumer SSD units per month within a three-year expansion plan.
• Pursue sustainable operations with an objective to reduce scope 1 & 2 CO2 intensity by 30% by 2030 (baseline 2023) and improve average device power efficiency by 20% per TB by 2027.

• Technological excellence: sustained R&D investment, patent growth target of 15% YoY, and a product reliability target of <0.5% annual return rate for enterprise-class SSDs.
• Open collaboration: establish 12+ strategic OEM/ODM and hyperscaler partnerships by 2026 and increase joint IP projects by 25% annually.
• Customer-centricity: aim for Net Promoter Score (NPS) ≥50 across enterprise clients and support SLAs with 99.9% service availability for key accounts.
• Integrity and transparency: maintain full IFRS-compliant reporting, with quarterly governance disclosures and a whistleblower response time target of ≤30 days.
• Continuous innovation: launch at least 3 major product platform upgrades within a rolling 36-month period and increase firmware update cadence to biannual major releases.
• Environmental sustainability: integrate circular design goals-30% recycled materials in packaging by 2026 and device-level energy-saving modes enabled across 100% of new product lines by 2025.

• Revenue growth ambition: target compound annual growth rate (CAGR) 15-20% over the next three fiscal years through product diversification and channel expansion.
• Gross margin optimization: aim to sustain gross margins in the mid-to-high 20% range through in-house controller development and vertical integration.
• CapEx and scale: plan incremental capital expenditures focused on capacity and automation-targeting a 25% throughput increase per production line within 24 months.
• ESG-linked incentives: tie up to 15% of executive variable compensation to sustainability KPIs and product energy-efficiency improvements.

• Partnership acceleration: deploy co-development labs with at least 4 hyperscalers/OEMs to shorten time-to-market by 30% for enterprise-class solutions.
• Customer enablement: roll out a global professional services program aiming to onboard 500 enterprise clients to managed storage offerings within two years.
• Quality and reliability: implement end-to-end traceability on production lines to reduce field failure rates by 40% over three years.