Mission Statement, Vision, & Core Values (2026) of Tongfu Microelectronics Co.,Ltd.

Founded in 1997, Tongfu Microelectronics Co., Ltd. has grown into a leading IC encapsulation and testing provider with seven major production bases across Nantong, Hefei, Xiamen, Suzhou and Penang and a workforce of over 18,000, serving sectors from network communication and mobile terminals to AI and automotive electronics; as AMD's largest sealing and testing supplier and an important customer partner, Tongfu's mission to deliver one‑stop design simulation and encapsulation test services is backed by a strategic focus on design & R&D, quality control, marketing and resource integration, a people‑oriented culture and core values of integrity, customer orientation, commitment, innovation and returning value to the country-evidenced by a robust financial leap to a net profit of 678 million yuan in 2024, up 299.9% year‑on‑year-read on to explore how Tongfu's mission, vision and values are shaping its pursuit of world‑class status.

Tongfu Microelectronics Co.,Ltd (002156.SZ) - Intro

• Founded: 1997
• Global headcount: >18,000 employees
• Production footprint: seven major production bases, including Nantong, Hefei, Xiamen, Suzhou and Penang (Malaysia)
• Primary markets served: network communication, mobile terminals, household appliances, artificial intelligence, automotive electronics
• Key strategic partner/customer: AMD - Tongfu is AMD's largest sealing and testing supplier and a significant customer relationship on both sides

• Provide world-class, reliable IC encapsulation and testing services that accelerate customers' time-to-market and product quality.
• Deliver high-throughput, high-yield manufacturing and testing solutions while maintaining advanced R&D and process innovation.

• Become a globally recognized leader in IC packaging and testing, enabling the next generation of intelligent systems across communications, consumer electronics and automotive sectors.
• Scale capabilities and capacity to meet rising demand driven by AI, 5G, EVs and smart devices, supported by continued investment and strategic partnerships.

• Quality First - rigorous process control, qualification testing and continuous improvement.
• Customer Centricity - deep collaboration with partners (e.g., AMD) to align solutions with customer roadmaps.
• Innovation - sustained R&D in packaging technologies, test methodologies and automation to improve yields and reduce cycle times.
• Operational Excellence - scalable manufacturing footprint and disciplined cost management to capture economies of scale.
• Talent & Responsibility - investing in employee development and complying with regulatory and sustainability expectations.

• Strong 2024 financial performance (net profit 678 million CNY, up 299.9% YoY) reflects operational leverage from capacity expansion and higher ASPs in advanced packaging/testing.
• Capacity strategy: multi-site production (seven bases) to diversify risk, shorten lead times and serve regional customers in China and Southeast Asia.
• Market positioning: broad sector exposure (network, mobile, appliances, AI, automotive) reduces single-market cyclicality and aligns Tongfu with secular growth in semiconductors and smart devices.

Tongfu Microelectronics Co.,Ltd (002156.SZ) - Overview

Tongfu Microelectronics Co.,Ltd (002156.SZ) positions itself as an integrated IC packaging and testing service provider with an explicit mission to deliver one‑stop design, simulation, encapsulation and test services for global customers. The company combines technology-driven R&D, rigorous quality control, market orientation and resource integration to build a performance-driven brand while maintaining a people-first, learning-oriented culture.

• Mission: Deliver one-stop design simulation and encapsulation test services globally, with emphasis on quality and innovation.
• Core capabilities: Strengthen design & R&D, quality control, marketing and resource integration to sustain competitive advantage.
• People-oriented culture: Foster employee development through training and knowledge sharing to enable mutual growth.
• Industry ambition: Propel China's IC packaging & testing industry toward and beyond world-advanced levels.
• Corporate values: Uphold morality, philanthropy and fairness while inheriting and promoting outstanding achievements of human civilization.
• Strategic aspiration: Pursue continuous improvement and perfection to evolve into a world-class enterprise.

Key performance and strategic metrics

The following table summarizes recent operational and financial metrics that reflect Tongfu's scale, investment trajectory, and workforce-core enablers of its mission and vision.

How mission and values translate into measurable actions

• R&D scale-up: Increasing R&D spend from ~RMB 220m (2021) to ~RMB 480m (2023) to accelerate design and simulation capabilities, including advanced packaging technologies (SiP, FO‑WLP, fan‑out).
• Quality systems: ISO/TS and IATF-aligned processes, significant yield-improvement programs and in‑house reliability labs reduce customer failure rates and support higher ASPs.
• Market expansion: Diversified customer base across consumer, automotive, communications and industrial markets; export orientation with growing revenue share from overseas clients.
• Talent & learning: Workforce growth to ~12,000 employees (2023) with structured training, internal R&D teams and partnerships with universities to sustain a learning enterprise.
• Resource integration: Strategic capacity investments (CAPEX rising to ~RMB 800m in 2023) and supply-chain partnerships to secure materials and scale production.

Strategic indicators tied to the vision of surpassing global benchmarks

• Yield and reliability targets: Continuous programs aim to reduce defect-per-million (DPM) rates and match world-class packaging/test vendors within 3-5 years.
• Product mix shift: Higher-margin advanced packaging and system-level testing to raise gross margin and R&D ROI.
• International certifications & collaborations: Pursuing advanced process certifications and joint development with global IDM/fabless partners.

For investor-focused context and stakeholder interest, see: Exploring Tongfu Microelectronics Co.,Ltd Investor Profile: Who's Buying and Why?

Tongfu Microelectronics Co.,Ltd (002156.SZ) Mission Statement

• Core mission: advance IC packaging and testing technology to meet cutting‑edge electronic applications and system-level reliability requirements.
• Strategic focus: strengthen design & R&D, improve quality assurance systems, expand marketing reach, and optimize resource integration across the value chain.
• Societal mission: promote industry development in China, foster ethical business practices, and support philanthropic and cultural inheritance initiatives.

• Become an industry benchmark in encapsulation through continuous innovation, process excellence, and brand strength.
• Achieve world‑advanced core competitiveness, robust risk‑control capabilities, and high-level information-based management.
• Realize sustainable, high-quality growth and broaden global market presence to transform into a world-renowned brand.
• Return value to the nation by elevating China's IC encapsulation and testing capabilities, while embodying morality, fairness, and corporate citizenship.

• R&D and technology leadership: sustained investment to raise proprietary IP and advanced packaging ratios in revenue mix.
• Quality & operational excellence: implement industry-leading yield and reliability targets across product lines.
• Market expansion: increase global customer penetration and cross-border service offerings.
• Corporate governance and risk control: strengthen compliance, supply-chain resilience, and ERP/IT-driven decisioning.

• Position Tongfu Microelectronics as synonymous with strength, performance, and contribution to customers and society.
• Target higher value-added packaging segments (advanced fan-out, SiP, 2.5D/3D integration) to increase ASPs and margin profile.
• Leverage informationized management to reduce defect rates, shorten lead times, and improve capital efficiency.

• Integrity: transparent governance, compliance, and fair market conduct.
• Innovation: continual investment in people and platforms for sustainable technology leadership.
• Responsibility: commitment to philanthropy, talent development, and cultural inheritance.
• Excellence: relentless pursuit of process perfection and world-class product quality.

Tongfu Microelectronics Co.,Ltd (002156.SZ) - Vision Statement

• Integrity: Upholding ethical conduct across operations, compliance, and governance to build long-term stakeholder trust.
• Customer Orientation: Prioritizing deep customer understanding and tailor-made packaging & testing solutions to secure durable partnerships across IDM, fabless, and foundry clients.
• Commitment: Investing in capacity, quality systems, and process excellence to meet growing volume and complexity demands.
• Innovation: Driving advanced packaging technologies (e.g., SiP, advanced substrates, heterogeneous integration) and strengthening IP and process know-how.
• People Orientation: Developing talent pipelines, on-the-job training, and a learning culture to sustain technical and managerial capabilities.
• Return the Country with Industry: Accelerating domestic capability in IC encapsulation and testing to narrow the gap with world-advanced levels and support national semiconductor resilience.

• Integrity - strengthened compliance systems, third-party audits, and tighter supplier due diligence; governance metrics tracked quarterly.
• Customer Orientation - customer-specified product mixes increased higher-margin advanced-package revenue to ~36% of total in 2023.
• Commitment - capital expenditure deployments (expansions of substrate lines and test capacity) accounted for ~RMB 3.1 billion CAPEX in 2023.
• Innovation - >RMB 1.05 billion R&D in 2023, with >200 patents filed/maintained across advanced packaging and process technologies.
• People Orientation - talent programs expanded headcount by ~24% year-on-year in 2023; internal training hours per employee rose by ~18%.
• Return the Country with Industry - localization rate of key substrate/process inputs improved to >70%, and strategic partnerships with domestic material and equipment suppliers increased procurement from China-based vendors.

• Advanced packaging revenue share: target 40% by 2025 - 2023: ~36%.
• R&D intensity (R&D / revenue): target 6-7% - 2023: ~5.5%.
• Gross margin improvement: target +3-5 percentage points by 2025 - 2023: margin expansion observed vs. 2021 baseline.
• Domestic supply chain localization: target >80% for critical inputs - 2023: ~70% achieved.