Mission Statement, Vision, & Core Values (2026) of SÃœSS MicroTec SE.

Explore how SÜSS MicroTec SE, with 75 years of engineering heritage, translates a clear mission-to empower semiconductor customers through innovation in back-end lithography, wafer bonding and photomask processing-into measurable market impact: global production in Germany, the USA and Asia, sales subsidiaries across Thailand, Japan, Taiwan, China and Korea, and a product suite spanning mask aligners, coater developers, inkjet printers, UV projection scanners and photomask equipment; the company's strategic vision to lead in advanced backend and photomask solutions is underscored by the fact that these areas accounted for >85% of sales in 2022, while 2024 financials show revenues of €446.1 million and a workforce of about ~1,498 employees, and its market significance is reflected by listings on SDAX and TecDAX-read on to see how core values like customer trust, partnerships, motivated employees, quality service and responsible technology leadership drive SÜSS's pursuit of customer-centric innovation

SÜSS MicroTec SE (0Q3C.L) - Intro

• Deliver high-precision microstructuring and process solutions that enable semiconductor and microsystem manufacturers to increase yield, performance and miniaturization.
• Combine engineering excellence with scalable manufacturing to support customers from R&D to high-volume production.
• Maintain a balance of innovation, operational excellence and customer-centric service across global markets.

• Be the preferred technology partner for advanced packaging, MEMS, photomasks and compound semiconductor production by providing adaptive, high-throughput equipment and process integration.
• Drive enabling technologies for next-generation semiconductor nodes, heterogeneous integration and novel microsystem applications.
• Expand global footprint and capabilities to anticipate demand shifts across memory, logic, sensors and photonics markets.

• Engineering Excellence - rigorous quality and precision in product development and manufacturing.
• Customer Focus - tailored process solutions and long-term partnerships across the value chain.
• Innovation - continuous investment in tools and processes that reduce defectivity and scale throughput.
• Global Collaboration - leveraging multi-site operations and regional sales to serve international customers.
• Responsibility - compliance with industry standards and commitment to sustainable operational practices.

• Scale production and service networks in Asia and North America to capture regional semiconductor capacity build-outs.
• Focus R&D roadmaps on higher-throughput lithography and alignment accuracy to support advanced packaging and heterogeneous integration.
• Strengthen customer process integration services to shorten time-to-yield for key accounts in memory, logic and MEMS.
• Maintain financial discipline while investing in modular, upgradeable platforms to extend product lifetime and customer value.

SÜSS MicroTec SE (0Q3C.L) - Overview

• Mission emphasis: customer enablement through innovation in back-end lithography, wafer bonding, photomask processing and related process equipment.
• Customer-centricity: product development and service models designed to respond to evolving needs in MEMS, sensors, power devices, and advanced packaging.
• Strategic objective: sustain competitive edge and expand share in critical segments by aligning R&D and capital deployment with fast-growing end markets.

• Back-end lithography systems optimized for wafer-level packaging and redistribution layer patterning, addressing advanced packaging throughput and overlay demands.
• Wafer bonding platforms enabling heterogeneous integration for MEMS, sensors, and advanced packaging stacks-improving yield and alignment accuracy at scale.
• Photomask handling and processing tools that support high-precision mask fabrication and inspection, reducing defects and turnaround time in photomask supply chains.
• Metrology and inspection modules that reduce scrap and rework by improving process control throughout back-end manufacturing.

• Growing addressable markets: MEMS, sensors, and advanced packaging demand has been increasing with WFE (wafer fab equipment) tailwinds for back-end tooling; SÜSS targets niches where precision and yield directly translate to customer TCO reductions.
• Revenue sensitivity: order intake and short-cycle aftermarket service revenues provide some resilience, but capital equipment cycles cause near-term volatility in top-line performance.
• Profitability drivers: margin improvement depends on higher mix of service & upgrades, increased utilization of installed base, and scaling of higher-margin product lines.

• Yield uplift: customer case studies report measurable yield and throughput improvements after integrating back-end lithography and bonding equipment, translating into lower per-unit manufacturing cost for advanced packaging and MEMS production.
• Total Cost of Ownership (TCO): solutions that combine process repeatability, field service, and upgrade paths are positioned to reduce customers' TCO over multi-year production ramps.

• Targeted R&D investments (≈8% of revenue) to maintain technological leadership in alignment, bonding and photomask handling.
• Aftermarket and service expansion to stabilize revenue and deepen customer relationships.
• Selective partnerships and geographic market coverage to capture growth in Asia and the US while leveraging German engineering for new applications.

SÜSS MicroTec SE (0Q3C.L) - Mission Statement

• Deliver high-yield, high-throughput equipment and process know-how for advanced backend (assembly, test, packaging) applications.
• Provide world-class photomask and lithography-related solutions that support patterning accuracy and cost-efficiency.
• Invest continuously in R&D and application engineering to translate customer requirements into production-ready tools and recipes.
• Maintain operational excellence and service networks to maximize installed-base uptime and customer ROI.

• Market leadership ambition in core competencies: advanced backend solutions and photomask equipment.
• Customer-driven innovation: customized tools and process integration to meet specific semiconductor customer needs.
• Concentration on high-value segments that historically drive the majority of group revenues and margins.
• Continuous improvement and efficiency gains to expand market share and strengthen profitability.

• Prioritise R&D and product roadmaps where customer demand drives higher ASPs and recurring service income.
• Deepen partnerships with leading semiconductor manufacturers to co-develop process-capable solutions and shorten qualification cycles.
• Scale global service footprint to convert installed base into predictable aftermarket revenue.
• Target margin expansion by improving manufacturing efficiency and broadening higher-value system sales.

SÜSS MicroTec SE (0Q3C.L) - Vision Statement

• Customer trust: long-term contracts, high uptime, and certified quality systems to reduce customer cycle time and risk.
• Partnerships: collaborative R&D with foundries, OEMs, and research institutes to accelerate productization.
• Motivated employees: targeted investments in talent development and a performance culture that fosters innovation.
• Quality service: field service, global spare-part availability, and service-level agreements ensuring continuity for customers.
• Responsible technology leadership: energy- and resource-efficient equipment and lifecycle management to meet ESG expectations.

• Customer trust: warranty performance metrics, customer satisfaction (NPS) programs, and contractual uptime guarantees to minimize operational risk for clients.
• Partnerships: co-development agreements and joint pilot lines with strategic customers; licensing and service frameworks to scale solutions.
• Motivated employees: structured training, talent retention programs, and performance-linked incentives focused on cross-functional innovation.
• Quality service: regional service hubs, spare-parts logistics, remote diagnostics, and certified quality management (ISO) to ensure fast response.
• Responsible technology leadership: product lifecycle assessments, materials restriction compliance (RoHS/REACH), and circular-economy measures for high-value equipment.

• Scaling field service networks and remote diagnostics to convert installed base into predictable recurring revenue and reinforce customer trust.
• Prioritizing modular, energy-efficient product development to meet customer cost-of-ownership demands and sustainability goals.
• Expanding collaborative R&D and partnership models with key customers and research partners to shorten time-to-market for novel processes and tools.
• Investing in employee training and cross-disciplinary teams to sustain innovation and high service quality.
• Embedding ESG criteria into product design and supplier selection to demonstrate responsible leadership.